Sechan has extensive experience in the manufacture of complex, high reliability circuit card assemblies. We provide full range processing capability including final item encapsulation and conformal coating. A wide range of surface mount, through-hole, and mixed technology applications move throughout the facility.

• RF, digital (high speed), and analog applications
• High density, multi-layered design, challenging thermal management, and precise component bonding

All circuit card assembly operations are performed by our experienced staff of IPC-A-610/ANSI J-STD-001 certified personnel. Our process engineering staff has an average tenure in excess of ten years who ensure that all products are in strict compliance with IPC-A-610, class 3 requirements.

Process Development

Our SMTA certified process engineering staff use their extensive experience, and the latest Aegis® CAD/CAM software to effectively and efficiently develop, document, and program complete processes. Strict change control procedures are applied to all process elements.

Equipment Capability

Our extensive complement of equipment can handle a wide range of process demands and is rigorously maintained and calibrated. Automated inspection is used to qualify solder print operations. Mid-process flying probe testing is combined with AOI/AXI operations to validate component placement and solder reflow process reliability/repeatability. Equipment technology capability includes:

• Speedline, MPM stencil Print Machines
• TYCO (QUAD) Component Pick and Place equipment
• BTU Convection Reflow Technology
• Wave (Vitronics Delta C) and Selective Solder (Jade) Capability
• Inline Aqueous Cleaning (Speedline Aquastorm)
• Automated 3-D X-ray
• Viscom AOI (3088II) and AOI/AXI (7056) systems (See Picture Below)