Sechan Electronics Inc., Lititz, Pennsylvania, is being awarded a $14,119,736 firm-fixed-price delivery order to previously awarded contract (N00024-12-D-5203) for Cooperative Engagement Capability (CEC) Signal Data Processor Assemblies (SDP-S). This contract combines purchases for the Navy (78 percent); the government of Japan (20 percent) under the Foreign Military Sales program; and the Marine Corps (2 percent). The SDP-S assembly provides the processing capability for the CEC. The CEC SDP-S assemble was developed through a technical refresh/crypto modernization effort to implement advantages provided by significant improvements in processor technologies. The design incorporates open architecture initiatives and satisfies sea, air and land-mobile requirement of the CEC system. This modification is to the established SDP-S production contract. Work will be performed in Lititz, Pennsylvania, and is expected to be completed July 2017. Working capital funds (Navy); foreign military sales; fiscal 2016 aircraft procurement (Navy); fiscal 2016 other procurement (Navy); fiscal 2016 shipbuilding and conversion (Navy); and fiscal 2016 procurement (Marine Corps ) funding in the amount of $14,119,736 will be obligated at time of award and funds will not expire at the end of the current fiscal year. The Naval Sea Systems Command, Washington, District of Columbia, is the contracting activity.
https://www.defense.gov/News/Contracts/Contract/Article/912283
Thursday, August 11, 2016
